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Uncategorised

Power modules benefit from press-fit terminals

Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB mounting and allow for automated or robotic…
14 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-14 19:37:342023-12-14 19:37:34Power modules benefit from press-fit terminals
Uncategorised

Cortex-M85 core empowers graphics MCUs

Renesas 32-bit graphics-enabled MCUs in the RA8D1 group are based on a 480-MHz Arm Cortex-M85 core with a performance rating of 6.39 CoreMark/MHz. Aimed at high-resolution display and voice/vision multimodal AI designs, the microcontrollers…
14 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-14 19:37:342023-12-14 19:37:34Cortex-M85 core empowers graphics MCUs
Uncategorised

OCXOs assist GPS-enabled defense systems

Endura Epoch MEMS oven-controlled oscillators (OCXOs) from SiTime boost the resiliency of defense positioning, navigation, and timing (PNT) systems. When the PNT system loses its GPS signal due to spoofing, jamming, or other disruptions, the…
14 December 2023
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Uncategorised

Protected gate drivers ensure safe operation

Power Integrations offers plug-and-play gate drivers with enhanced protection features for 62-mm SiC MOSFET and Si IGBT modules rated up to 1700 V. The Scale-2 2SP0230T2x0 dual-channel gate drivers deploy short-circuit protection against overcurrent…
14 December 2023
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Uncategorised

Card-edge connectors offer reliable spring contacts

Kyocera AVX has released the 9159-7X0 series of double-ended linear card-edge connectors with beryllium copper spring contacts. Rated at up to 2 A per contact, the robust spring contact system provides solder-free mating, high electrical and…
14 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-14 19:37:342023-12-14 19:37:34Card-edge connectors offer reliable spring contacts
Uncategorised

Strengthening the pillars of information assurance in a world of evolving threats

It is the responsibility of every organization with an online presence to make sure they protect their data from unwanted access. By now, everyone should be aware of the tremendous damage an organization can face if it falls victim to a successful…
14 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-14 17:53:402023-12-14 17:53:40Strengthening the pillars of information assurance in a world of evolving threats
Uncategorised

A non-destructive readout mechanism for ferroelectric capacitors

Compute-in-memory (CiM) has become an attractive computing paradigm to address the memory and power walls in traditional designs for deep learning applications. With CiM, part of the computation needed to run deep learning algorithms can be…
14 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-14 06:26:362023-12-14 06:26:36A non-destructive readout mechanism for ferroelectric capacitors
Uncategorised

New full-wave precision rectifier has versatile current mode output

A classic analog application is the full-wave precision rectifier (absolute value) function. Many variations exist on this theme, each with its own supposed (often rather minor and sometimes downright dubious) advantages compared to competing…
13 December 2023
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Uncategorised

Why package lithography matters in heterogeneous chiplet integration

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic partnership between Applied Materials and Ushio,…
13 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-13 06:04:322023-12-13 06:04:32Why package lithography matters in heterogeneous chiplet integration
Uncategorised

Multivibrator also makes true-zero output of the op-amp

While choosing an op-amp buffer, some sources of negative supply were considered, because the buffer op-amp had to provide true zero voltage on its output. In reality, a typical rail-to-rail output op-amp isn’t capable of this, it can guarantee…
12 December 2023
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Uncategorised

An assortment of tech-hiccup tales

As 2023 draws to a close, the cadence of tech issues I’m experiencing seems to be accelerating. Some of this increase, I suspect, has to do with technologies (and the hardware and software associated with them) that I’m trying out for the…
11 December 2023
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2023-12-11 16:43:152023-12-11 16:43:15An assortment of tech-hiccup tales
Uncategorised

Silicon is still viable in power, claims a new MOSFET architecture

While we’ve been hearing the drumbeat of “silicon is dead” in power semiconductors for nearly 10 years, according to Mark Granahan, CEO of iDEAL Semiconductor, it’s mainly the lack of innovation in silicon that has enabled that drumbeat.…
11 December 2023
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