Power modules benefit from press-fit terminals
Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB mounting and allow for automated or robotic installation in high-volume manufacturing environments.
The precise location of terminals and the press-fit pin design of the power modules creates a high-reliability contact with the PCB. There are over 200 variants in Microchip’s SP1F and SP3F power module portfolio, with the option to use the company’s mSiC or Si semiconductors. They also offer an array of topologies and ratings, spanning a voltage range of 600 V to 1700 V and current ratings up to 280 A.
SP1F and SP3F DC/DC power modules with press-fit terminals are available now. To learn more about the power modules, click here. For purchase information, contact a Microchip sales representative, authorized distributor, or visit the Microchip Direct website.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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