IGBT7 modules cut power losses up to 20%
Microchip’s DualPack 3 (DP3) IGBT7 power modules come in six variants at 1200 V and 1700 V with current ratings from 300 A to 900 A. They reduce power losses by 15% to 20% compared to IGBT4 devices and operate reliably up to 175°C under overload…
Pressure washer recall and aluminum electrolytic capacitors
I recently came across a disturbing piece of news about a recall of Ryobi pressurized washers on FOX Business (Figure 1). I got some pictures from there and elsewhere, which, with a little rearrangement and supplementation, point out a very…
High-speed digitizer boasts open FPGA architecture
High-speed data acquisition is made simple with a 12-bit digitizer that offers up to 10 GSPS sampling rate and 2 Gbyte/s sustained data transfer to a host PC. Teledyne’s ADQ3-series digitizer provides high-performance data acquisition in a…
Capacitor matchmaker
Precision-matched capacitor pairs are commercially available items, but only in a limited range of values, working voltage, and dielectrics.
Plus, sometimes an extra critical application with extra tight tolerances (or an extra tight budget)…
Tektronix releases its new high-performance 7 Series oscilloscope
Today, Tektronix, i.e., Tek, releases its high-performance oscilloscope: The 7 Series digital phosphor oscilloscope (DPO) (Figure 1). This scope is a replacement of its discontinued (but still sought-after) 70000 series, using the same probe…
Class D: Audio amplifier ascendancy
Last month, an interesting Class AB audio amplifier was in the spotlight, a monoblock-configured pair of which I’m actually listening to (Widespread Panic’s Light Fuse Get Away, to be precise) as I type these follow-on words:
This time,…
Putting 3D IC to work for you
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA sneak peak at 3D IC design toolkits and workflowss…
Fake contacts, bounced to order
Many recent Design Ideas have involved button-pushing to control power. Some may have been more resistant to contact-bounce than others—but how can we really check that? This DI describes how some simple circuitry can simulate bouncy contacts,…
The fundamentals of cadence sensing for pedal rotation tracking
A cadence sensor is a compact cycling device that measures your pedaling rate in revolutions per minute (RPM), providing real-time feedback to help optimize performance and training efficiency. Here is a hands-on guide to the core principles…
Inter-die gapfill tool claims advanced packaging breakthrough
A new inter-die gapfill tool is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. VECTOR TEOS 3D provides ultra-thick, uniform inter-die gapfill by leveraging Lam Research’s proprietary bowed…
Apple’s 2H 2025 announcements: Tariff-touched but not bound, at least for this round
On Tuesday, Apple, as usual for a September, unveiled its latest-generation tranche of iPhones, Apple Watches, wireless headphones, and the like, at its as-usual-prerecorded “Awe Inspiring” event (here’s last year’s event coverage from…
RISC-V IP expands AI capabilities at the edge
SiFive’s Intelligence Gen 2 RISC-V IP portfolio combines scalar, vector, and matrix compute to accelerate AI workloads. The Gen 2 lineup includes the new X160 and X180, alongside the upgraded X280, X390, and XM series. All products feature…
