IGBT7 modules cut power losses up to 20%
Microchip’s DualPack 3 (DP3) IGBT7 power modules come in six variants at 1200 V and 1700 V with current ratings from 300 A to 900 A. They reduce power losses by 15% to 20% compared to IGBT4 devices and operate reliably up to 175°C under overload conditions.
Available in a phase-leg configuration, the 152×62×20-mm DP3 modules support a frame size jump to increase power output. This packaging eliminates the need to parallel multiple modules, reducing system complexity and BOM cost. DP3 modules also serve as a second-source alternative to industry-standard EconoDUAL packages, improving design flexibility and supply chain security.
The IGBT power modules support motor drive, data center, and renewable energy systems with a compact design that simplifies power converters. They are well-suited for general-purpose motor drives and address challenges such as dv/dt, drive complexity, conduction losses, and limited overload capability.
DualPack 3 IGBT7 power modules are now available in production quantities. Additional information and datasheets can be found here.
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