Proper IC interconnects for high-speed signaling
The increased demand for high-speed data transmission fueled by social media and online activities in the past two decades lead to the use of more complex ICs operating at higher speed on higher density PCBs. The combination of the high density…
Memory in automotive designs: An industry in transition
Memory chips serving automotive markets have come a long way over the past decades, and if there is one area that has driven the shift in their use inside vehicles, it’s the adoption of advanced driver assistance systems (ADAS) and autonomous…
A closer look at Microsoft’s custom chip duo for AI, cloud workloads
Microsoft, which developed silicon for Xbox two decades ago and later co-designed chips for Surface devices, has unveiled two custom chips: Azure Maia for artificial intelligence (AI) servers and Azure Cobalt CPU for cloud workloads. It shows…
Processor board augments endoscopic imaging
Omnivision’s OVMed OH0131 image signal processor (ISP) works with both reusable and disposable endoscopes connected to tablets or camera controllers. The OH0131 kernel employs image pre-processing algorithms supporting brightness, contrast,…
PCTEL expands embedded antenna lineup
PCTEL announced an embedded antenna platform for integrated radio deployments, providing off-the-shelf Wi-Fi solutions to a broader set of customers. The portfolio comprises compact, low-profile designs that provide wide coverage patterns in…
Earbud speaker performs ultrasonic modulation
Cypress, a solid-state MEMs speaker from xMEMS Labs, replaces legacy push-air sound reproduction with ultrasonic amplitude modulation transduction. Using this principle, Cypress turns ultrasonic air pulses into rich, bass-heavy, high-fidelity…
8-bit MCUs exploit 32-bit development tools
BB5x 8-bit MCUs from Silicon Labs join the company’s PG2x family of 32-Bit MCUs in sharing a common development environment. The Simplicity Studio software is also the development platform for Silicon Labs’ portfolio of wireless SoCs, allowing…
SiC modules meet diverse power requirements
SemiQ’s 1200-V SiC MOSFETs can be copackaged with or without a 1200-V SiC Schottky barrier diode (SBD) in SOT-227 packages. The QSiC modules provide a breakdown voltage of >1400 V and low on-resistance shift over the full operating temperature…
Protecting antennas: Part 2
Looking at the damage done to a protected antenna over time.
A while back, we looked at how an antenna structure was provided with a protective, cylindrical enclosure.
Taking another look via Google Maps, we find an image of the protected antenna…
Ultrasonic sensors find new applications in IoT
Ultrasonic sensors have been a staple in the sensing space for several decades due to their capabilities, flexibility, and low cost. As the rise of IoT finds its way into virtually every market and industry, ultrasonic sensors have continued…
Simultaneously control gain on two independent channels with a single element pot
A question that arises frequently in audio and signal processing applications is this: How can I control gain on dual channel (e.g., stereo) inputs simultaneously with only a single knob? Of course, an obvious solution would be to simply use…
Extending network-on-chip (NoC) technology to chiplets
A monolithic integrated circuit (IC) is one in which everything is implemented on a single silicon die, also called a chip. The maximum practical size for a die using extreme ultraviolet (EUV) lithographic process is around 25 mm x 25 mm = 625…
