• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
      • 2026 – Summer
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

Automotive HMI SiP packs MPU and DDR2 memory

The SAM9X75D5M from Microchip is a hybrid SiP for automotive HMI applications, integrating an 800‑MHz ARM926EJ‑S 32‑bit processor with 512 Mbits of DDR2 SDRAM. The package also includes a 24‑bit LCD controller supporting displays up to 10 in. with XGA resolution (1024×768), simplifying high-performance graphical interfaces.

This hybrid SiP combines MPU-class processing with high-density memory in a single package, reducing PCB complexity while maintaining MCU-style development workflows. For automotive and e-mobility HMIs, it offers real-time OS support and flexible display and camera interfaces, including MIPI DSI, LVDS, RGB, MIPI CSI, and 12-bit parallel I/F.

AEC-Q100 Grade 2 qualified, the SAM9X75D5M provides CAN FD, USB, and Gigabit Ethernet connectivity with Time-Sensitive Networking (TSN) capability. It also integrates 2D graphics, audio, and advanced security functions.

The device comes in a 243‑ball BGA package (part number SAM9X75D5M‑V/4TBVAO) and is priced at $9.12 each in 5000‑unit quantities. Variants with 1 Gbit and 2 Gbits of memory are now sampling.

SAM9X75D5M product page 

Microchip Technology 

The post Automotive HMI SiP packs MPU and DDR2 memory appeared first on EDN.

30 March 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-03-30 15:05:572026-03-30 15:05:57Automotive HMI SiP packs MPU and DDR2 memory

Latest news

  • The multi-gig Ethernet migration: Motivations and implementations8 October 2026 - 13:29
  • GaN FET meets megawatt-scale demands7 October 2026 - 20:15
  • FPGA IP accelerates deterministic networking7 October 2026 - 20:15
  • Microphone array advances acoustic detection7 October 2026 - 20:15
  • Quad beamformer simplifies X-band radar design7 October 2026 - 20:15
  • Global-shutter sensor raises pixel density7 October 2026 - 20:15
  • An unbuttoned circuit for setting digital pots7 October 2026 - 13:10
  • Training and inference: Two faces of AI compute7 October 2026 - 11:08
  • Reducing I/O requirements for optical detection6 October 2026 - 13:47
  • Continuity testing in semiconductor ATE: Fundamentals and test methods6 October 2026 - 08:43
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Link to: SiC modules raise power density for AI servers Link to: SiC modules raise power density for AI servers SiC modules raise power density for AI servers Link to: FET-based clamp protects 48-V USB PD EPR lines Link to: FET-based clamp protects 48-V USB PD EPR lines FET-based clamp protects 48-V USB PD EPR lines
Scroll to top Scroll to top Scroll to top