Solid-state fan chip reduces heat in XR glasses
xMEMS is bringing its µCooling fan-on-chip platform to AI-driven extended reality (XR) smart glasses. The silicon-based solid-state micro cooling chip provides localized, precision-controlled active cooling from within the glasses frame—without compromising form factor or aesthetics.
As smart glasses integrate more advanced AI processors, cameras, sensors, and high-resolution displays, total device power (TDP) is expected to rise from today’s 0.5–1 W to 2 W and beyond. This increase pushes more heat into the frame materials that rest directly against the skin, exceeding what passive heat sinking can effectively dissipate.
According to xMEMS, thermal modeling and physical verification of µCooling in smart glasses operating at 1.5 W TDP has demonstrated a 60–70% improvement in power overhead, allowing up to 0.6 W additional thermal margin. It also showed up to a 40% reduction in system temperatures and up to a 75% reduction in thermal resistance.
Built on a piezoMEMS architecture with no motors or bearings, the fan chip delivers silent, vibration-free operation in a package as small as 9.3×7.6×1.13 mm.
µCooling samples for XR smart glasses are available now, with volume production planned for Q1 2026. To learn more about xMEMS active µCooling, click here.
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