Optimize hi-rel designs with rugged, flexible interconnects
As OEMs in high-reliability industries, including automotive, industrial, and military/aerospace, move to next-generation designs, they are looking for interconnects that not only offer high reliability and ruggedness but also greater design flexibility and miniaturization. The availability of more product options and easier integration and installation are also key requirements.
The combination of greater flexibility and miniaturization is delivering space and cost savings across rugged designs while supporting next-generation systems, such as vehicle platforms that are packing more and more electronic components into space-constrained devices.
Here is a selection of connectors and cable assemblies introduced over the past year that meet the right balance of features for these application trends. These include software-defined vehicles (SDVs) and zonal electronic/electrical (E/E) architectures; next-generation military/aerospace systems and unmanned aerial vehicles (UAVs); and industrial automation systems that need greater flexibility and adaptability.
Automotive connectors and cables
Molex recently expanded its HSAutoLink interconnect portfolio with the launch of the HSAutoLink G, comprised of terminals, connectors, PCB headers, and cables. It joins the existing rugged, high-speed HSAutoLink, HSAutoLink II, and HSAutoLink C families.
The connector system provides multi-gigabit Ethernet connections of up to 25 Gbits/s in a compact, USCAR-compatible interface, making it suited to address rising bandwidth demands driven by advanced driver-assistance systems (ADAS), radar, LiDAR, zonal architecture, immersive displays, and central compute modules.
By extending support with Ethernet connections up to 25 Gbits/s, these interconnects can meet the high bandwidth requirements in SDVs and autonomous mobility platforms, Molex said.
Fitting within existing USCAR Ethernet interfaces, the HSAutoLink G enables future-proof product designs that reduce space and weight in compact modules while streamlining system integration and upgrades. Key features include advanced electromagnetic-interference (EMI) shielding and controlled differential impedance to maintain signal integrity for high-speed communications in dense environments. This helps prevent signal failures, validation delays, and costly design changes, the company said.
Other features include an anti-stubbing design that protects the contacts during the mating process to reduce the risk of mis-mating, as well as the addition of multiple, uniform ground-contact points to enhance EMI suppression for higher reliability.
As automakers shift to SDVs and zonal E/E architectures, TE Connectivity (TE) has introduced a portfolio of interconnects for automotive electronic control units (ECUs). The Inside Device Connectivity portfolio is designed to support the next generation of vehicle platforms. The purpose-built portfolio includes board-to-board, wire-to-board, flex-to-board, and wire-to-wire connector solutions for compact, high-performance applications.
The Inside Device Connectivity portfolio is tailored to the specific needs of SDVs, enabling scalable and standardized connector configurations while reducing weight, packaging space, and integration complexity, TE said.
At the same time, these interconnects are optimized for EMI-sensitive and vibration-intensive environments with high misalignment tolerance and ruggedness against vibration, contamination, temperature shifts, and humidity. Other features include current capacity up to 45 A for wire-to-board and up to 18 A for board-to-board; a pitch of 0.4 mm to 10.16 mm with up to 180 pins; and crimp, IDC, and mass terminations.
These connectors target different application areas in an SDV, including ECUs, power conversion (on-board charger inverters and DC/DC converters), battery systems (battery, cell module controller, and battery management system), high-performance computers, ADAS (radar and LiDAR), and black-box systems (such as lighting).
Interconnects for military, aerospace, and UAVs
Samtec Inc. recently expanded its SMPM cable-to-board precision RF connector family with small-form-factor threaded cable-to-board-mated sets, targeting high-vibration environments. Suited for applications such as military, aerospace, and communication applications, the connector assemblies feature a threaded SMPM MIL-STD-348 interface with a retractable threaded coupling nut.
High-vibration environments can exceed the retention capabilities of traditional push-on RF interconnects, Samtec explained, requiring a more secure and robust connection.
The threaded SMPM cable-to-board-mated connector sets—including the RF047-A and RF086 millimeter-wave, low-loss cable assembly families handling up to 67 GHz, as well as the SMPMT threaded, SMPM millimeter-wave board-mount plugs available up to 60 GHz—are designed with enhanced mechanical strength. They feature full detent or smooth bore for varying retention forces and offer mixed technology board termination, which provides resistance to mechanical stress and supports high frequency.
The RF047-A is a 0.047-inch, low-loss, flexible microwave cable assembly (29 AWG) with an extremely small bend radius of 3.18 mm. The RF086 is a 0.086-inch, low-loss, flexible cable (23 AWG) with a bend radius of 8.9 mm. Both operate up to 125°C. A variety of end options are available for application-specific customization.
These precision RF connectors are available from stock. The RF047-A cable assembly and SMPMT threaded plugs are part of the Samtec Reserve program with one-day shipment.
For avionics and UAVs, Times Microwave Systems launched its Levitate cable assembly line for both military and commercial RF systems. Designed for efficiency, weight savings, and electrical performance, these ultra-lightweight cable assemblies with minimal loss are suited for avionics applications across UAV Groups 1 through 5.
Times Microwave Systems claims that the Levitate assemblies provide the lightest weight per unit of loss available on the market today, enabling engineers to reduce overall system mass without compromising RF performance. They cover a range of airborne applications, including flight control, communications, and surveillance.
Providing a balance between cost, performance, and availability, the Levitate cable assembly is available in multiple sizes, including the LVT047, LVT086, LVT141, LVT157, and LVT196. All assemblies are engineered for dual use in military and commercial RF systems. The flexible construction of the LVT047, LVT086, and LVT141 assemblies is suited for in-the-box applications, and the ultra-lightweight LVT157 and LVT196 support critical RF runs connecting antennas to LRUs.
Connectors for industrial automation
Aimed at delivering greater design flexibility and simplicity, binder USA LP, a subsidiary of binder Group, recently announced a new generation of hybrid connectors for industrial automation. The B23 series combines power supply and shielded data transmission in one compact connector and enables Ethernet transmission rates of up to 100 Mbits/s.
The B23 connector is built for one-cable-automation concepts, addressing key market requirements that call for a reduced cabling effort and increased data rates in industrial systems. This simplifies integration and system architectures.
The hybrid connector reduces cabling effort by enabling power and communication via a single interface, which also reduces installation times and potential sources of error, binder said. One example cited is drive technology, in which servo motors and drive systems can be connected with just one cable. It can also be used in modular machine and plant architectures, as well as robotics and flexible manufacturing systems.
The B23 connector also targets the trend toward decentralized automation that requires rugged, pluggable connections and a high degree of protection. Key specs include power transmission up to 28 A at up to 630 V and shielded Ethernet/EtherCAT (according to Cat 5) data transmission up to 100 Mbits/s. Other features include a bayonet quick-locking system for secure connections, screw-clamp termination for field use, and IEC 61076-2-118 standardization.
Meeting both field and device integration requirements, the B23 is available in a field-attachable version and as a panel-mount connector for device installation. Versions with single-wire termination and THT contacts are available.
Hirose Electric Co. Ltd. expanded its high-density BGA mezzanine connector portfolio with a COM-HPC standard-compatible version that supports PCIe Gen5 (32 GT/s), Gen6 (64 GT/s PAM4), and 100-Gb Ethernet (4 × 25 Gb). The IT18 Series can be used in industrial automation, medical imaging, and T&M equipment.
The BGA mezzanine connector features an ultra-high-density pin count of 400 positions in a 0.635-mm pitch, delivering high-speed transmission in a low profile. Stacking heights include 5 mm and 10 mm. It also features high crosstalk suppression, including far-end-crosstalk cancellation technology.
The open-field design (open pin-field grid array) of the connector is adaptable to various layouts, allowing for greater flexibility across different applications. Because pins are not locked into a fixed pattern, customers can route signals, grounds, and power to improve density and performance, which also helps with signal-integrity optimization, Hirose said.
Featuring a rugged design, the IT18 Series connector uses a metal cap to reduce warpage and protect contacts from flux. The cap minimizes reflow defects by suppressing deformation during heating and protecting against foreign particles in the environment, the company said. Other key features include a large guide to ensure proper mating and retention tabs that prevent cracks in solder balls.
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