• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

How SiC and GaN are reshaping automotive power electronics

Wide-bandgap (WBG) materials, particularly silicon carbide (SiC) and gallium nitride (GaN), are no longer considered exotic semiconductors. The automotive industry has chosen them for their ability to switch faster, tolerate higher blocking…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 19:47:382026-07-29 19:47:38How SiC and GaN are reshaping automotive power electronics
Uncategorised

Advantech AI servers leverage AMD EPYC

Advantech is launching a portfolio of servers based on AMD EPYC 9006 SP8 processors to support next-generation AI infrastructure. Servers, such as the SKY-924E5F, provide the scalability and reliability required for AI, high-performance computing…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 18:47:112026-07-29 18:47:11Advantech AI servers leverage AMD EPYC
Uncategorised

Ryzen processors power physical AI workloads

Optimized for physical AI, AMD’s Ryzen AI Embedded X100 series processors combine CPU, GPU, and NPU resources on a single embedded SoC. With up to 16 AMD Zen 5 CPU cores, an integrated GPU, power-efficient NPU, and unified memory, the processors…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 18:47:112026-07-29 18:47:11Ryzen processors power physical AI workloads
Uncategorised

Half-brick converter packs high power density

Advanced Energy’s AIH03ZPFC power factor correction (PFC) converter delivers 1100 W of output power in a half-brick form factor. The board-mount module achieves up to 97.3% peak efficiency and a power density of 380 W/in³. According to the…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 18:47:112026-07-29 18:47:11Half-brick converter packs high power density
Uncategorised

AI platform unifies PCB, advanced packaging workflows

Cadence says its AuraStack AI Super Agent is the industry’s first agentic AI platform for PCB and advanced packaging design. Running on the company’s Allegro AI Studio and accelerated by NVIDIA Blackwell GPUs and NVIDIA CUDA-X libraries,…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 18:47:112026-07-29 18:47:11AI platform unifies PCB, advanced packaging workflows
Uncategorised

Edge AI coprocessor adopts M.2 form factor

Based on BrainChip’s Akida neuromorphic engine, the AKD1500 edge AI coprocessor is now available in a compact M.2 2230 (22×30 mm) form factor. The card features a B+M key edge connector for use with Raspberry Pi 5 and compatible host systems,…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 18:47:102026-07-29 18:47:10Edge AI coprocessor adopts M.2 form factor
Uncategorised

Accelerating the shift to next-gen SDVs with zonal MCUs

As the automotive industry shifts toward software-defined vehicles (SDVs), with features and updates delivered via software, vehicle electrical/electronic (E/E) architectures are evolving. These architectures are moving away from traditional…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 15:45:242026-07-29 15:45:24Accelerating the shift to next-gen SDVs with zonal MCUs
Uncategorised

Phantom-powered solid-state linear airflow sensor

Self-heated Darlingtion transistor pair linearly senses airflow using just two wires for both power in and signal out. Suppose we take a common TO-92 transistor and heat it to a constant temperature differential above ambient.  The power input…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 13:44:052026-07-29 13:44:05Phantom-powered solid-state linear airflow sensor
Uncategorised

AI infrastructure is a multi-fab physical realization stack

When people talk about AI hardware, the conversation usually begins with the AI accelerator. That is understandable. GPUs, custom AI accelerators, CPUs, and high-performance compute dies are the most visible symbols of the AI era. They are also…
29 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-29 08:40:322026-07-29 08:40:32AI infrastructure is a multi-fab physical realization stack
Uncategorised

Why analog anti-tamper security IP is crucial in the PQC era

The global semiconductor industry is transitioning to the post-quantum cryptography (PQC) era. PQC is changing how digital systems defend against potential mathematical attacks. PQC algorithms are designed to protect against hackers who try…
28 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-28 14:23:052026-07-28 14:23:05Why analog anti-tamper security IP is crucial in the PQC era
Uncategorised

Add-on beat frequency oscillator (BFO) for shortwave radio

Expensive shortwave radios include beat frequency oscillators, so why not also add one to an inexpensive radio version? Broadcast shortwave (SW) radio use may be declining, but there are still lots of interesting signals to listen to between…
28 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-28 13:22:242026-07-28 13:22:24Add-on beat frequency oscillator (BFO) for shortwave radio
Uncategorised

Rapid scale-up in data center: The case for distributed optical circuit switching

AI infrastructure is moving from server-scale acceleration to multi-rack supernodes that must behave like a single, highly available computer. Distributed optical circuit switching offers a practical way to extend scale-up fabrics with lower…
28 July 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-07-28 07:18:242026-07-28 07:18:24Rapid scale-up in data center: The case for distributed optical circuit switching
Page 3 of 187‹12345›»

Latest news

  • Bear on a power pole7 August 2026 - 13:46
  • Why software-defined systems require a dynamic data layer7 August 2026 - 10:42
  • Paper-based passives show impact of re-thinking substrate6 August 2026 - 16:22
  • Drone bans harm customers and don’t actually close the door6 August 2026 - 13:20
  • BMICs enable scalable battery monitoring6 August 2026 - 04:16
  • DDR5 MRDIMM chipset boosts server bandwidth6 August 2026 - 04:16
  • MCUs streamline single-motor control6 August 2026 - 04:16
  • MRDIMM enables higher DDR5 bandwidth6 August 2026 - 04:16
  • CXL controller scales server memory6 August 2026 - 04:16
  • Hz to 4-20mA or 0-20mA current source is compatible with grounded loads5 August 2026 - 13:57
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Scroll to top Scroll to top Scroll to top