SFP: The single-mode module autopsy

This initial entry in a planned dissection series analyzes the insides of a long distance-capable fiber optic cable networking adapter containing a focused-beam laser. Last week’s tutorial, the conceptual kickoff to the teardown coverage cadence…

Unmasking the ghosts in your grid with power quality analyzers

Power that looks perfect can still betray you. Hidden distortions in the mains lurk behind flawless root mean square (RMS) readings—waiting to trip up even the best‑designed systems. You’ve built the device exactly to spec, tested it in…

Some tips for electrical engineers

Chime in with your suggestions in the comments. We’ll even allow the mechanical engineers out there to participate. Well…maybe. The following are a few of the tips, advice, rules, or guiding principles, I’ve discovered after many years…

FPGA architecture: SEU detection and recovery strategies

Part 1 of this mini-series covering single event upset (SEU) challenges in FPGA architectures examined radiation particles and related SEU challenges for FPGA applications that require robustness and predictability in ground-based and terrestrial…

Highly integrated approach to power system design in the AI era

Packaging innovation in the AI era has reached the doorsteps of power electronics. A new architecture uses the silicon wafer itself as the package foundation to enable a highly integrated approach to power system design. It optimizes electrical,…

SFP: Add-in module delivers diminutive performance, flexibility

Want to network-connect your gear using prevalent wired Ethernet? Or interference-impervious optical fiber? How about a bandwidth boost? Or a range extension? SFP and its siblings do it all. One recent sequential-coverage cadence of mine just…

Sensor sharpens infrared in-cabin imaging

The ST SafeSense VD56GA 1.1-Mpixel automotive image sensor enables infrared in-cabin sensing for driver and occupant monitoring applications. Based on ST’s DeepNIR BSI pixel architecture, the sensor delivers 35% higher modulation transfer…

Transient voltage suppression devices reach 11 kW with flat clamping

Vishay’s XFD11KxxCA flat-clamping transient voltage suppression (TVS) devices provide 11 kW of peak pulse power dissipation at 10/1000 µs. Offered in surface-mount DO-218AC packages, the bidirectional devices maintain a low clamping ratio…

SPAD sensor processes photon events on-chip

Singular Photonics’ Litavis is a CMOS single-photon avalanche diode (SPAD) image sensor with integrated digital photon processing on-chip and in-pixel. By processing photon events directly on-chip, it reduces the volume of raw data that must…

Anti-surge resistors reduce component count

Anti-surge chip resistors in Rohm’s SDR01 series deliver a rated power of 0.33 W in the 0402 (1005 metric) package. The devices save board space and lower component count by replacing larger-size resistors in automotive, industrial, and AI…

Pin-compatible MPUs simplify product variants

Renesas offers the RZ/G3L and RZ/G3SE series of 64-bit general-purpose microprocessors for consumer and industrial HMI and IoT edge systems. Expanding the company’s RZ/G portfolio, the pin-compatible MPUs allow developers to reuse a PCB design…

FPGA architecture: Radiation particle types and single event upsets (SEUs)

As FPGA manufacturing migrates to smaller geometries, the process change has delivered extraordinary gains in density, speed, and power efficiency. However, these gains have come at a cost in terms of single event upset (SEU) sensitivity. Starting…