There was one heck of a scary item in the news recently. The following screenshots were taken from a video that was recorded in the teeth of recent inclement weather. Overhead power lines had actually caught fire.
Figure 1 Overhead power lines…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-20 18:06:362026-02-20 18:06:36Burning power lines
In this post, we will take a gentle dive into logarithmic amplifiers—commonly known as log amps—those quietly powerful circuits that work behind the scenes to decode exponential signals and tame wide dynamic ranges.
Log amps: Basics and…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-20 18:06:362026-02-20 18:06:36Logarithmic amplifiers: A quick tour of theory and practice
Samsung has begun mass production and commercial shipments of its HBM4 DRAM, marking what it describes as an industry first. Built on Samsung’s 6th-generation 10-nm-class DRAM process with a 4-nm logic base die, this high-bandwidth memory…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 17:09:182026-02-19 17:09:18Samsung leads with HBM4 DRAM performance
The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the optimization of complex interconnect structures—including…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 17:09:182026-02-19 17:09:18Software accelerates 3D interconnect design
Navitas Semiconductor has announced its 5th-generation GeneSiC platform featuring high-voltage trench-assisted planar (TAP) SiC MOSFETs, describing it as a significant advancement over previous generations. The new 1200-V MOSFET line complements…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 17:09:182026-02-19 17:09:18Navitas tightens SiC losses with refined TAP
ST’s VNQ9050LAJ 4-channel high-side driver controls 12-V automotive ground-connected loads via a 3-V and 5-V CMOS-compatible interface. Operating from 4-V to 28-V with typical RDS(on) as low as 50 mΩ per channel, the device remains active…
Empower has launched three embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processors. The portfolio includes the EC2005P (9.34 μF in a 2×2-mm package), EC2025P (18.68 μF in a 4×2-mm package), and EC2006P…
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Modern digital oscilloscopes offer a host of analysis capabilities since they digitize and store input waveforms for analysis. Most oscilloscopes offer basic math operations such as addition, subtraction, multiplication, division, ratio, and…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 14:00:072026-02-19 14:00:07Using integration and differentiation in an oscilloscope
Preventing fires and other calamities by proactively shutting off power in advance of inclement weather is dependent on forecast precision; customers’ needs should also be a considered factor.
Following up on my prior blog post, wherein I…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 14:00:072026-02-19 14:00:07Preemptive utilities shutdown oversight: Too much, too little, or just right?
Every major computing era has been defined not by technology, but by a dominant workload—and by how well processor architectures adapted to it.
The personal computer era rewarded general-purpose flexibility, allowing x86 to thrive by doing…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-19 07:49:282026-02-19 07:49:28AI is stress-testing processor architectures and RISC-V fits the moment
Frequent contributor R. Jayapal recently shared an interesting Design Idea (DI) for power supply control and sequencing in MCU-based applications that combine analog and digital circuitry: “Short push, long push for sequential operation of…
As artificial intelligence (AI) continues its momentum across the electronics ecosystem, 2026 is shaping up to be a defining year for edge AI. After years of rapid advancement in cloud‑centric AI training and inference, the industry is reaching…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-02-18 08:18:122026-02-18 08:18:12AI in 2026: Enabling smarter, more responsive systems at the edge
Burning power lines
Logarithmic amplifiers: A quick tour of theory and practice
Samsung leads with HBM4 DRAM performance
Software accelerates 3D interconnect design
Navitas tightens SiC losses with refined TAP
Automotive high-side driver withstands cold crank
Embedded capacitors improve AI/HPC power delivery
Using integration and differentiation in an oscilloscope
Preemptive utilities shutdown oversight: Too much, too little, or just right?
AI is stress-testing processor architectures and RISC-V fits the moment
Silly simple supply sequencing
AI in 2026: Enabling smarter, more responsive systems at the edge