Embedded capacitors improve AI/HPC power delivery
Empower has launched three embedded silicon capacitors (ECAPs) for AI and high-performance computing (HPC) processors. The portfolio includes the EC2005P (9.34 μF in a 2×2-mm package), EC2025P (18.68 μF in a 4×2-mm package), and EC2006P (36.8 μF in a 4×4-mm package). These components are designed for integration into processor substrates to support elevated current density and fast transient load demands.
As AI and HPC workloads increase, conventional board-mounted capacitors struggle to maintain low impedance and fast response. These ECAP devices provide high capacitance density with ultralow equivalent series inductance (ESL) and resistance (ESR), improving power delivery network (PDN) performance when embedded close to the die. Tight dimensional tolerances ensure compatibility with advanced packaging flows.
The ECAP portfolio also supports vertical power delivery architectures, including Empower’s Crescendo platform, to reduce loop inductance and system footprint. The devices provide a scalable approach for integrating silicon capacitance directly within processor packages.
The EC2005P, EC2025P, and EC2006P ECAPs are now in mass production. Learn more about the ECAP portfolio here.
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