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Uncategorised

Teradyne snaps up TestInsight to boost ATE for semiconductors

Automated test equipment (ATE) supplier Teradyne is bolstering its test solutions for semiconductor design by acquiring TestInsight, a provider of test program creation, pattern conversion, and pre-silicon validation tools used across ATE platforms…
17 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-17 14:53:552026-04-17 14:53:55Teradyne snaps up TestInsight to boost ATE for semiconductors
Uncategorised

Aliasing, the bane of sampled data systems

Aliasing is thankfully becoming a less frequent problem due to improved instrument designs. Users should still be aware of it to prevent time- and money-costly errors. Aliasing is an ever-present potential problem in sampled data acquisition…
17 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-17 13:53:362026-04-17 13:53:36Aliasing, the bane of sampled data systems
Uncategorised

Bluetooth LE throughput: Why real‑world performance falls short of specs

Many Bluetooth Low Energy (LE) applications depend on reliable, high‑throughput data transfer between connected devices. Typical use cases include over‑the‑air (OTA) firmware updates, sensor data streaming, and bulk data transport between…
17 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-17 10:49:442026-04-17 10:49:44Bluetooth LE throughput: Why real‑world performance falls short of specs
Uncategorised

Simulation tool tests assembly processes upfront

With Keysight Assembly simulation software, automotive manufacturers can virtually test shop-floor processes to identify issues early in development. Late-stage assembly failures drive delays, rework, and recalls. By delivering early insight…
16 April 2026
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Uncategorised

SMT DIP switches fit space-constrained PCBs

Littelfuse’s TDB series of miniature DIP switches uses a 1.27-mm half-pitch, surface-mount design to reduce PCB footprint. The compact devices support high-density layouts where space, reliability, and manufacturability matter. The switches…
16 April 2026
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Uncategorised

Wilkinson divider/combiner reduces insertion loss

The Vishay WLKN-000 two-way Wilkinson power divider/combiner operates from 15 GHz to 20 GHz, centered at 18 GHz. By integrating a resistor with the transmission lines, the compact surface-mount device simplifies system design and saves space…
16 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-16 16:23:072026-04-16 16:23:07Wilkinson divider/combiner reduces insertion loss
Uncategorised

Digital isolators strengthen industrial systems

Part of Diodes’ RobustISO family, the API782x series of dual-channel digital isolators delivers 5.7-kVRMS isolation for 1 minute per UL 1577. The devices offer reliable protection for digital control and communication signals in solar inverters,…
16 April 2026
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Uncategorised

DSC integrates control, sensing, security

Microchip’s dsPIC33AK256MP306 digital signal controller (DSC) combines a 200-MHz, 32-bit core and double-precision FPU with high-resolution PWMs and high-speed ADCs. It also includes a hardware crypto accelerator with support for post-quantum…
16 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-16 16:23:072026-04-16 16:23:07DSC integrates control, sensing, security
Uncategorised

The system architect’s sketchbook: The coherency wall

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers. The post The system architect’s sketchbook: The coherency wall…
16 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-16 16:23:062026-04-16 16:23:06The system architect’s sketchbook: The coherency wall
Uncategorised

Engineering tradeoffs: a camera case study

Four cameras, from two companies. Similar at first glance. Quite different once you zoom in and ponder the picture a while. Which approach is superior? Share your opinions in the comments! The way this is going, and to remain honest both with…
16 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-16 13:21:392026-04-16 13:21:39Engineering tradeoffs: a camera case study
Uncategorised

The system architect’s sketchbook: The AI hiring frenzy

Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers. The post The system architect’s sketchbook: The AI hiring frenzy…
15 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-15 16:03:032026-04-15 16:03:03The system architect’s sketchbook: The AI hiring frenzy
Uncategorised

Give bare-metal multicore processing a try

Multicore processing boosts performance and energy efficiency in many coding situations. Bare-metal algorithms further enhance these benefits. Many embedded firmware engineers have seemingly not yet tried multicore processing. Using processors…
15 April 2026
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