Automated test equipment (ATE) supplier Teradyne is bolstering its test solutions for semiconductor design by acquiring TestInsight, a provider of test program creation, pattern conversion, and pre-silicon validation tools used across ATE platforms…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-17 14:53:552026-04-17 14:53:55Teradyne snaps up TestInsight to boost ATE for semiconductors
Aliasing is thankfully becoming a less frequent problem due to improved instrument designs. Users should still be aware of it to prevent time- and money-costly errors.
Aliasing is an ever-present potential problem in sampled data acquisition…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-17 13:53:362026-04-17 13:53:36Aliasing, the bane of sampled data systems
Many Bluetooth Low Energy (LE) applications depend on reliable, high‑throughput data transfer between connected devices. Typical use cases include over‑the‑air (OTA) firmware updates, sensor data streaming, and bulk data transport between…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-17 10:49:442026-04-17 10:49:44Bluetooth LE throughput: Why real‑world performance falls short of specs
With Keysight Assembly simulation software, automotive manufacturers can virtually test shop-floor processes to identify issues early in development. Late-stage assembly failures drive delays, rework, and recalls. By delivering early insight…
Littelfuse’s TDB series of miniature DIP switches uses a 1.27-mm half-pitch, surface-mount design to reduce PCB footprint. The compact devices support high-density layouts where space, reliability, and manufacturability matter.
The switches…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-16 16:23:072026-04-16 16:23:07SMT DIP switches fit space-constrained PCBs
The Vishay WLKN-000 two-way Wilkinson power divider/combiner operates from 15 GHz to 20 GHz, centered at 18 GHz. By integrating a resistor with the transmission lines, the compact surface-mount device simplifies system design and saves space…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-16 16:23:072026-04-16 16:23:07Wilkinson divider/combiner reduces insertion loss
Part of Diodes’ RobustISO family, the API782x series of dual-channel digital isolators delivers 5.7-kVRMS isolation for 1 minute per UL 1577. The devices offer reliable protection for digital control and communication signals in solar inverters,…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-16 16:23:072026-04-16 16:23:07Digital isolators strengthen industrial systems
Microchip’s dsPIC33AK256MP306 digital signal controller (DSC) combines a 200-MHz, 32-bit core and double-precision FPU with high-resolution PWMs and high-speed ADCs. It also includes a hardware crypto accelerator with support for post-quantum…
Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers.
The post The system architect’s sketchbook: The coherency wall…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-16 16:23:062026-04-16 16:23:06The system architect’s sketchbook: The coherency wall
Four cameras, from two companies. Similar at first glance. Quite different once you zoom in and ponder the picture a while. Which approach is superior? Share your opinions in the comments!
The way this is going, and to remain honest both with…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-16 13:21:392026-04-16 13:21:39Engineering tradeoffs: a camera case study
Deepak Shankar, founder of Mirabilis Design and developer of VisualSim Architect platform for chip and system designs, has created this cartoon for electronics design engineers.
The post The system architect’s sketchbook: The AI hiring frenzy…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-15 16:03:032026-04-15 16:03:03The system architect’s sketchbook: The AI hiring frenzy
Multicore processing boosts performance and energy efficiency in many coding situations. Bare-metal algorithms further enhance these benefits.
Many embedded firmware engineers have seemingly not yet tried multicore processing. Using processors…
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png00whdsolutionshttp://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.pngwhdsolutions2026-04-15 13:01:322026-04-15 13:01:32Give bare-metal multicore processing a try
Teradyne snaps up TestInsight to boost ATE for semiconductors
Aliasing, the bane of sampled data systems
Bluetooth LE throughput: Why real‑world performance falls short of specs
Simulation tool tests assembly processes upfront
SMT DIP switches fit space-constrained PCBs
Wilkinson divider/combiner reduces insertion loss
Digital isolators strengthen industrial systems
DSC integrates control, sensing, security
The system architect’s sketchbook: The coherency wall
Engineering tradeoffs: a camera case study
The system architect’s sketchbook: The AI hiring frenzy
Give bare-metal multicore processing a try