SMT DIP switches fit space-constrained PCBs
Littelfuse’s TDB series of miniature DIP switches uses a 1.27-mm half-pitch, surface-mount design to reduce PCB footprint. The compact devices support high-density layouts where space, reliability, and manufacturability matter.
The switches are available in 2-, 4-, 6-, 8-, and 10-position SPST configurations, with body lengths ranging from 3.67 mm to 13.83 mm depending on position count. Contact ratings of up to 50 VDC, 100 mA (steady state) and 24 VDC, 25 mA (switching) make them suitable for low-power industrial control, as well as consumer IoT and smart home devices. Contact resistance is 100 mΩ maximum, and insulation resistance is 100 MΩ minimum at 100 VDC.
Compatible with automated SMT assembly, the switches feature gold-plated bifurcated contacts and top tape sealing for post-reflow washable processing. They offer a mechanical and electrical life of 1000 cycles and operate over a temperature range of –40°C to +85°C.
The TDB series switches are available in tube or tape-and-reel packaging for high-volume production. Samples can be obtained through authorized Littelfuse distributors.
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