The interposer-to-PCB realization corridor in CoWoP

Part 1 of this mini-series on advanced packaging outlined the basic comparison between CoWoS, wafer-scale integration, and CoWoP. It established why the package substrate, silicon wafer, and platform PCB represent different settings for future…

Wireless module simplifies multiprotocol IoT design

Built around the NXP RW612 wireless MCU, Quectel’s FCM365X module combines dual-band Wi-Fi 6, Bluetooth LE 5.4, Zigbee, and Thread connectivity in a single device. It integrates a 260-MHz Arm Cortex-M33 processor with TrustZone, 1.2 MB of…

80-V MOSFET improves power supply efficiency

The TPM1R408RH 80-V N-channel MOSFET is built on Toshiba’s latest-generation low-voltage U-MOS11-H process. It features an optimized device structure with an RDS(on) of 1.4 mΩ—about 26% lower than the 80-V TPM1R908QM based on the previous-generation…

UWB SoC provides precise distance measurement

Infineon’s AIROC UWB TSL100 SoC enables centimeter-level distance measurement and localization using ultra-wideband (UWB) time-of-flight (ToF) technology. Designed for low-power, secure operation, the device targets automotive, consumer, and…

Chip combines NFC and post-quantum security

ST’s ST54M integrates a post-quantum cryptography (PQC) hardware accelerator, NFC controller, secure element, and eSIM on a single die. The chip helps smartphone and personal electronics manufacturers prepare for future post-quantum security…

Hall current sensor delivers sigma-delta output

The Melexis MLX91229 Hall current sensor provides a second-order sigma-delta digital output that improves signal integrity in EV traction inverter applications. Optimized for automotive systems, this output tolerates heavy EMI, helping maintain…

Position sensor gets linear 4 to 20mA current source output

A linearized output is a useful elaboration of a capacitive sensor design. But what if the circuit is located a significant distance from the control electronics? Recently, Design Ideas included a circuit that comprised a simple analog interface…

CoWoS, wafer-scale and CoWoP: Why AI packaging bottleneck is moving

Advanced AI systems are forcing the semiconductor industry to rethink the boundary between silicon, package, board, power delivery, memory, cooling, and manufacturing. For several years, the dominant discussion has centered on advanced packaging…

Implementing a DAC: The battle of the PWMs

Ones and zeroes: are clustered or spread out bits better? “It depends,” is the answer. Well, at least sorta. In the Comments section of a recent Design Idea for a DAC (Reference 1), one reader expressed a full-throated preference for an…

Hidden underflow in BF16 divider in mixed-precision FP designs

Floating-point computations dominate the landscape of all AI/ML compute but also in automotive, avionics and healthcare. While performance and compute errors dominated the landscape of floating-point design and verification, power optimizations…

Dissecting an active Ethernet splitter

Need just one more network port than you’ve currently got available (often: none)? A splitter can do the trick; just spend a few extra bucks to make sure you’ve made the right pick. I’ll begin this teardown with an analogy. Imagine you’re…

EAS tags: The invisible backbone of retail security

In the world of retail, security is not always about cameras or guards; it’s often about technology you barely notice. Electronic article surveillance (EAS) tags are a prime example: small, lightweight devices that quietly safeguard billions…