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iToF sensor provides on-chip depth processing

An indirect time-of-flight sensor, the AF0130 from onsemi offers long-distance measurements and 3D imaging of fast-moving objects. It features a depth processing ASIC beneath its pixel area, which rapidly calculates depth, confidence, and intensity maps from laser modulated exposures.

The AF0130, part of the Hyperlux ID sensor family, combines global shutter and iToF technology for precise, high-speed depth sensing. It measures phase shifts in reflected VCSEL light, capturing four light phases in one exposure for enhanced accuracy. A global shutter reduces ambient IR noise, while onboard depth processing and memory enable real-time results without external memory or a high-performance processor.

onsemi states that the AF0130 enables depth sensing up to 30 meters—four times the range of standard iToF sensors. The 1.2-Mpixel CMOS sensor features 3.5-µm BSI pixels in a 1/3.2-in. optical format. A variant, the AF0131, delivers the same performance but excludes on-chip depth processing for manufacturers preferring off-chip depth calculation.

Availability for the AF0130 and AF0131 sensors was not provided at the time of this announcement.

AF013X product page

onsemi

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

The post iToF sensor provides on-chip depth processing appeared first on EDN.

14 March 2025
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