EDA tool tackles 3D IC design challenges
GENIO EVO, an integrated chiplet/package EDA tool from MZ Technologies, addresses thermal and mechanical stress in the pre-layout stage of 3D IC design. Set to be demonstrated at this month’s Chiplet Summit, GENIO EVO is the second generation of MZ’s flagship GENIO cross-fabric platform for system design. Like its predecessor, GENIO EVO enables co-design of chiplets, dies, silicon interposers, packages, and surrounding PCBs to meet area, power, and performance targets.
GENIO EVO integrates seamlessly with existing commercial implementation platforms or custom EDA flows through plugins. Operating at the architectural level, it provides optimal system choices for 2.5D or 3D multi-die designs. A new user interface supports a cross-hierarchical, 3D-aware design methodology that streamlines the system design process. By integrating IC and advanced packaging design, it ensures full system-level optimization, shorter design cycles, faster time-to-manufacturing, and improved yields.
The platform identifies and analyzes thermal and mechanical failures. It supports architectural exploration and what-if analysis in the early design stages to improve implementation predictability. By planning and managing high-pin-count interconnects in complex multi-fabric designs, it anticipates and avoids downstream thermal and mechanical issues.
GENIO EVO is available for immediate licensing. For more information, click the link below.
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