Dev kit uses backscatter Wi-Fi for low-power connectivity
HaiLa Technologies has introduced the EVAL2000 development board, featuring its BSC2000 passive backscatter Wi-Fi chip and ST’s STM32U0 MCU. The platform empowers developers and researchers to create ultra-low-power connected sensor applications over Wi-Fi.
The BSC2000 is a monolithic chip that combines analog front-end and digital baseband components to implement HaiLa’s backscatter protocol for 802.11 1-Mbps Direct Sequence Spread Spectrum (DSSS) over Wi-Fi. By using backscattering, it enables low-power communication by reflecting existing Wi-Fi signals instead of generating its own. This allows devices to transmit data with minimal energy consumption. Leveraging readily available, standard Wi-Fi infrastructure, the BSC2000 backscatter Wi-Fi chip collects and transmits sensor data with power efficiency that extends the life of battery-operated sensors.
The EVAL2000 development board accelerates prototyping with GPIO, I2C, and SPI sensor interfaces. Sensor integration is handled through firmware on the MCU. The kit also includes an onboard temperature/humidity sensor.
The BSC2000 EVAL2000 development kit is available for preorder, with shipping anticipated for Q1 2025. For more information on the backscatter Wi-Fi chip and development kit, click here.
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