Antenna-matching ICs cut RF design complexity
ST offers three antenna-matching companion chips for STM32WL33 wireless MCUs to help streamline the development of IoT, smart metering, and remote monitoring systems. The MLPF-WL-01D3, MLPF-WL-02D3, and MLPF-WL-04D3 integrate impedance matching and harmonic filtering on a single glass substrate to boost RF performance.
By integrating antenna protection, matching, and filtering, the devices simplify RF routing, improve reliability, and reduce BOM cost by replacing multiple discrete components. The three Series 3 chips will be joined by four new variants, supporting radio optimization across high-band (826–958 MHz) and low-band (413–479 MHz) ranges, high-power (16/20 dBm) and low-power (10 dBm) modes, and 2-layer or 4-layer PCB designs.
The MLPF-WL-01D3, MLPF-WL-02D3, and MLPF-WL-04D3 antenna-matching ICs are available now in 5-bump chip-scale packages, priced from $0.15 each in 1000-unit quantities. Release dates for the additional variants were not available at the time of this announcement.
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