SECO pairs Dragonwing with HMI and SBC
SECO has developed a 5-in. industrial HMI panel and a compact SBC, both based on the Qualcomm Dragonwing IQ-2390 processor. The Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390 target industrial connected devices for HMI, control, vending, building automation, industrial vision, and other compact embedded applications.
With a quad-core CPU and 1.1-TOPS NPU, the Compact Vision 5 Dragonwing IQ-2390 is designed for applications requiring touch interaction, industrial reliability, and entry-level on-device AI. It integrates a 5-in. (800×480-pixel) touchscreen, 3D GPU, up to 4 GB of RAM, and 16 GB of eMMC storage in a 145.5×102.4×33.4-mm enclosure. The panel-mount unit supports Wi-Fi and Bluetooth and includes MIPI-DSI, RS-232, CAN, Gigabit Ethernet, and USB-C interfaces.
Aimed at custom embedded systems, the SBC-Dragonwing-IQ-2390 provides the same processing, memory, and connectivity as the Compact Vision 5 on a small 47×114-mm board. Both platforms run Clea OS, based on Yocto Linux, providing a software environment for development, deployment, and lifecycle management.
Register for the Early Access Program to receive information on evaluation options and next steps for the Compact Vision 5 Dragonwing IQ-2390 and SBC-Dragonwing-IQ-2390.
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