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The ASIC design remake in the AI era

The traditional ASIC design model—focusing on relatively stable standards and well-defined functions—is now under pressure. That’s partly because AI workloads are highly diverse, compute-intensive, and tightly coupled to software behavior and system context. Consequently, ASICs, besides being application-specific, are now increasingly becoming system-specific.

Take the case of a custom chip for LLM inference, where the prefill and decode stages are now running on separate chips. So, there are two ASICs instead of one: the compute-intensive part of the application (prefill) and the memory-bandwidth-limited part of the application (decode). That shows how ASICs are increasingly becoming modular and disaggregated with cross-domain collaboration spanning architecture, packaging, and manufacturing.

Read the full article at EDN’s sister publication, EE Times.

The post The ASIC design remake in the AI era appeared first on EDN.

23 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-23 08:01:432026-04-23 08:01:43The ASIC design remake in the AI era

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