Silicon capacitors slash mounting area
Housed in tiny DFN0402-2 packages, silicon capacitors in Rohm’s BTD1RVFL series conserve space in smartphones and wearables. With dimensions of 0.4×0.2×0.185-mm, Rohm claims the devices are the industry’s smallest in a mass-produced surface-mount package. Further, the 0402 mounting area is just 0.08 mm2, approximately 55% smaller than the 0603 size package.
The silicon capacitors use a trench structure to increase the capacitance per unit area of the substrate. Miniaturization technology allows processing in 1-µm increments, which eliminates chipping during external formation and improves dimensional tolerances to within ±10 µm.
The first two devices in the lineup, the BTD1RVFL102 and BTD1RVFL471, have a rated voltage of 3.6 V and capacitance of 1000 pF and 470 pF, respectively. Capacitance tolerance is ±15%, and the parts operate over a temperature range of -55°C to +150°C. A built-in TVS protection element ensures high ESD resistance of ±8 kV. Five additional devices with capacitance ratings of 680 pF, 330 pF, 220 pF, 150 pF, and 100 pF are under development.
The BTD1RVFL102 and BTD1RVFL471 silicon capacitors are available now. Rohm is working on a second series for release in 2024 that will offer improved high-frequency characteristics for communication applications.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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