Module streamlines smart home device connectivity
The KGM133S, the first in a range of Matter over Thread modules from Quectel, enables seamless interoperability for smart home devices like door locks, sensors, and lighting. Powered by Silicon Labs’ EFR32MG24 wireless chip, the module uses Matter 1.4 to connect devices across multiple ecosystems, including Apple Home, Google Home, Amazon Alexa, and Samsung SmartThings. Thread 1.4 support ensures compatibility with IPv6 addressing.
The KGM133S features an Arm Cortex-M33 processor running at up to 78 MHz, with 256 KB of SRAM and up to 3.5 MB of flash memory. With a receive sensitivity better than -105 dB and a maximum transmit power of 19.5 dBm, the module ensures reliable signal transmission. In addition to Matter over Thread, the KGM133S also supports Zigbee 3.0 and Bluetooth LE 6.0 connectivity.
Two LGA packaging options are available for the KGM133S to accommodate both compact and slim terminal designs. The first option (12.5×13.2×2.2 mm) features a fourth-generation IPEX or pin antenna, while the second option (12.5×16.6×2.2 mm) comes with an onboard PCB antenna.
A timeline for availability of the KGM133S wireless module was not disclosed at the time of this announcement.
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