• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
      • 2026 – Summer
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

Industrial MCU packs EtherCAT controller

GigaDevice has introduced the GD32H75E 32-bit MCU, featuring an integrated GDSCN832 EtherCAT subdevice controller, which is also available as a standalone device. Both components target industrial automation applications, including servo control, variable frequency drives, industrial PLCs, and communication modules.

Powered by an Arm Cortex-M7 core running at up to 600 MHz, the GD32H75E microcontroller includes a DSP hardware accelerator, double-precision floating-point unit, hardware trigonometric accelerator, and filter algorithm accelerator. It also comes with 1024 KB of SRAM, up to 3840 KB of flash memory with security protection, and a 64-KB cache to enhance CPU efficiency and real-time performance.

The MCU’s integrated EtherCAT subdevice controller, licensed from Beckhoff Automation, manages EtherCAT communication, acting as an interface between the EtherCAT fieldbus and the sub-application. It includes two internal PHY ports and an external MII. With 64-bit distributed clock support, it enables synchronization with other EtherCAT devices, achieving DC synchronization accuracy to within 1 µs.

The GD32H75E MCU is available in two variants: one with two internal Ethernet PHYs and another that supports bypass mode, both housed in BGA240 packages. Samples and development boards are available now, with mass production planned for Q2 2025.

GD32H75E product page

GigaDevice 

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

<!–
googletag.cmd.push(function() { googletag.display(‘div-gpt-ad-native’); });
–>

The post Industrial MCU packs EtherCAT controller appeared first on EDN.

2 January 2025
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2025-01-02 21:03:512025-01-02 21:03:51Industrial MCU packs EtherCAT controller

Latest news

  • FPGA architecture: Radiation particle types and single event upsets (SEUs)16 September 2026 - 14:25
  • Digital pot programming with a twist16 September 2026 - 13:24
  • A design path to success exists for ultra-low-voltage SoCs15 September 2026 - 15:01
  • DAC implementations: The spread-bit PWM strikes back15 September 2026 - 14:01
  • Caliptra-enabled hardware security solution eyes AI SoCs15 September 2026 - 10:00
  • Radon sensor embeds sizeable alpha particle detector14 September 2026 - 13:42
  • Beyond the port: Fundamentals of passive radiators14 September 2026 - 09:40
  • Electron beam energy11 September 2026 - 13:40
  • You just Inherited a Simulink model you have never seen before. Now what?11 September 2026 - 11:38
  • Debugging intermittent Comcast, part 4: Broadband diagnostics10 September 2026 - 13:22
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Link to: The advent of co-packaged optics (CPO) in 2025 Link to: The advent of co-packaged optics (CPO) in 2025 The advent of co-packaged optics (CPO) in 2025 Link to: Wireless audio SoC integrates AI processing Link to: Wireless audio SoC integrates AI processing Wireless audio SoC integrates AI processing
Scroll to top Scroll to top Scroll to top