Cadence debuts AI thermal design platform
Cadence Celsius Studio, an AI-enabled thermal design and analysis platform for electronic systems, aims to unify electrical and mechanical CAD. The system addresses thermal analysis and thermal stress for 2.5D and 3D ICs and IC packaging, as well as electronics cooling for PCBs and complete electronic assemblies.
With Celsius Studio, electrical and mechanical/thermal engineers can concurrently design, analyze, and optimize product performance within a single unified platform. This eliminates the need for geometry simplification, manipulation, and/or translation. Built-in AI technology enables fast and efficient exploration of the full design space to converge on the optimal design.
The multiphysics thermal platform can simulate large systems with detailed granularity for any object of interest, including chip, package, PCB, fan, or enclosure. It combines finite element method (FEM) and computational fluid dynamics (CFD) engines to achieve complete system-level thermal analysis. Celsius Studio supports all ECAD and MCAD file formats and seamlessly integrates with Cadence IC, packaging, PCB, and microwave design platforms.
Customers seeking to gain early access to Celsius Studio can contact Cadence using the product page link below.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
googletag.cmd.push(function() { googletag.display(‘div-gpt-ad-native’); });
–>
The post Cadence debuts AI thermal design platform appeared first on EDN.
