Bluetooth LE SoC slashes power consumption
Renesas offers the DA14592 Bluetooth LE SoC, which the company says is its lowest power and smallest multicore Bluetooth LE device in its class. The device balances tradeoffs between on-chip memory and SoC die size to accommodate a broad range of applications, including crowd-sourced locationing, connected medical devices, metering systems, and human interface devices.
Along with an Arm Cortex-M33 CPU, the DA14592 features a software-configurable Bluetooth LE MAC engine based on an Arm Cortex-M0+. A new low-power mode enables a radio transmit current of 2.3 mA at 0 dBm and a radio receive current of 1.2 mA.
The DA14592 also supports a hibernation current of just 90 nA, which helps to extend the shelf-life of end products shipped with the battery connected. For products requiring extensive processing, the device provides an ultra-low active current of 34 µA/MHz.
Requiring only six external components, the DA14592 lowers the engineering BOM. Packaging options for the device include WLCSP (3.32×2.48 mm) and FCQFN (5.1×4.3 mm) The SoC’s reduced BOM, coupled with small package size, helps designers minimize product footprint. Other SoC features include a sigma-delta ADC, up to 32 GPIOs, and a QSPI supporting external flash or RAM.
The DA14592 Bluetooth LE SoC is currently in mass production. Renesas also offers the DA14592MOD, which integrates all of the external components required to implement a Bluetooth LE radio into a compact module. The DA14592MOD module is targeted for world-wide regulatory certification in 2Q 2024.
Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.
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