AI platform unifies PCB, advanced packaging workflows
Cadence says its AuraStack AI Super Agent is the industry’s first agentic AI platform for PCB and advanced packaging design. Running on the company’s Allegro AI Studio and accelerated by NVIDIA Blackwell GPUs and NVIDIA CUDA-X libraries, the platform coordinates domain-specific AI agents across planning, implementation, and tightly integrated multiphysics analysis. AuraStack joins Cadence’s ChipStack, InnoStack, and ViraStack AI Super Agents, extending the company’s agentic AI portfolio across IC design, advanced packaging, and PCB design.
Built on the same architecture as Cadence’s ChipStack AI Super Agent, AuraStack combines agentic AI with simulation and optimization tools to automate design exploration, implementation, and signoff. An AI-driven multiphysics foundation concurrently models electrical, thermal, and mechanical behavior to support earlier design optimization.
According to Cadence, AuraStack can accelerate time to market by up to 2× and increase productivity by up to 15× while identifying system issues earlier in the design process to help reduce costly respins. It also enables system-level co-optimization with advanced packaging technologies, including CoWoS, to improve product performance and manufacturability.
Cadence plans to make the AuraStack AI Super Agent available in 2026.
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