• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
      • 2026 – Spring
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

GaN FETs serve as drop-in SiC replacements

Transphorm announced two SuperGaN FETS in 4-lead TO-247 packages, offering an original design option or alternative to 4-lead silicon or SiC devices. The TP65H035G4YS and TP65H050G4YS are both 650-V FETs with an on-resistance of 35 mΩ and 50-mΩ, respectively. Based on the company’s GaN-on-silicon substrate process, the devices are well-suited for high-volume manufacturing on silicon production lines.

The two SuperGaN FETs support power supplies at 1 kW and higher in such applications as data centers, renewables, and industrial equipment. Their 4-lead configuration provides a Kelvin source terminal to enhance switching efficiency. In a hard-switched synchronous boost converter, the 35-mΩ 4-lead FET reduced losses by 15% at 50 kHz and 27% at 100 kHz compared to a SiC MOSFET with comparable on-resistance.

The TO-247-4L devices offer the following core specifications:

The 50-mΩ TP65H050G4YS is available now. The 35-mΩ TP65H035G4YS is sampling and slated for release in Q1 2024.

TP65H035G4YS datasheet

TP65H050G4YS datasheet

Transphorm

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

<!–
googletag.cmd.push(function() { googletag.display(‘div-gpt-ad-native’); });
–>

The post GaN FETs serve as drop-in SiC replacements appeared first on EDN.

18 January 2024
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 2024-01-18 21:20:062024-01-18 21:20:06GaN FETs serve as drop-in SiC replacements

Latest news

  • Secrets of Oscilloscope Time Measurements14 August 2026 - 13:44
  • Radon: Level detection, risk determination, and as-needed mitigation13 August 2026 - 13:16
  • TI a first mover in CAN XL transceivers13 August 2026 - 10:13
  • Four-channel USB-UART IC boosts server management13 August 2026 - 05:08
  • eFuse speeds overcurrent detection13 August 2026 - 05:08
  • Memory platform tackles AI bottlenecks13 August 2026 - 05:08
  • 6.5-kV SiC MOSFET reaches 8-kV blocking13 August 2026 - 05:08
  • Made by Google 2026: This limited silicon-supply situation really sucks13 August 2026 - 05:08
  • Cheap and cheerful LMC555 RC PWM pulse generator12 August 2026 - 13:56
  • Record high wafer shipments. Can fabs keep pace?12 August 2026 - 07:51
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Link to: TDK releases ultrasonic sensor demo kit Link to: TDK releases ultrasonic sensor demo kit TDK releases ultrasonic sensor demo kit Link to: LED backlight driver offers dual LCD bias Link to: LED backlight driver offers dual LCD bias LED backlight driver offers dual LCD bias
Scroll to top Scroll to top Scroll to top