Software accelerates 3D interconnect design
The Keysight Chiplet 3D Interconnect Designer automates the design of 3D interconnects for chiplet and 3DIC advanced packages. By removing time-consuming manual steps, the tool streamlines the optimization of complex interconnect structures—including vias, transmission lines, solder balls, and micro-bumps—while ensuring signal and power integrity in densely packed systems.
Part of Keysight’s EDA portfolio, the software provides a pre-layout workflow for advanced multi-die integration, UCIe compliance, automated routing, and robust simulation capabilities. It handles complex geometries—including hatched or waffled ground planes—that are critical for addressing manufacturing and fabrication constraints, particularly in silicon interposers and bridges.
The software can operate independently or alongside Keysight’s other EDA tools, enabling teams to seamlessly incorporate 3D interconnect workflows into their existing design environments.
To learn more about the Keysight Chiplet 3D Interconnect Designer (W3510E) and request a quote, visit the product page linked below.
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