Next-gen components power safer, smarter vehicles
As the automotive industry continues to shift toward software-defined vehicles (SDVs), autonomous driving, and connected vehicles, it raises challenges around performance, reliability, and security. Component makers have a big role to play by delivering next-generation designs that support the transition to these new automotive architectures.
The July/August issue takes a look at advances happening at the component level that are enabling next-generation automotive technologies. These range from zonal microcontrollers (MCUs) and gallium nitride (GaN) and silicon carbide (SiC) power devices to connectors and LEDs/LED drivers. We also look at safety and security challenges in SDVs.
As vehicle electrical/electronic architectures evolve and the automotive industry transitions to SDVs, it raises new technical challenges for automakers. In particular, the move from domain-based to zonal architectures that group vehicle functions presents challenges, as each zone controller needs to handle a wide range of tasks. This means the ECUs in a zonal design require compute capabilities that can handle both time-sensitive and compute-intensive workloads concurrently.
“In a zonal architecture, each zone of a vehicle, such as front, rear, or cabin, has a high-performance controller managing local devices and communicating with other controllers over high-speed networks,” said Paul S. Lee, senior director, automotive microcontrollers, zonal segment leader, at NXP Semiconductors.
Although this approach is faster to update, easier to scale, less complex, and even cheaper, it also presents new technical challenges for automakers, Lee said. He discusses key challenges in the move to SDVs and how zonal MCUs are building the foundation for the next generation of SDVs.
Another big challenge in SDVs is the cybersecurity threat. Rambus is calling for a collaborative effort among engineers, security teams, and end users to create a secure SDV ecosystem.
“SDVs continuously evolve through over-the-air updates, unlocking new features, optimizing performance, and enhancing safety over time,” said Paul Karazuba, VP of product marketing for silicon IP at Rambus. “While this shift continues to enable greater connectivity, automation, and personalization, it also expands the cybersecurity threat landscape,” and as “SDVs integrate with cloud systems, mobile apps, and AI-driven features, they become more vulnerable to cyberattacks.”
Karazuba discusses this expanding cybersecurity threat landscape and how to ensure security frameworks that enable SDV features while protecting user safety and data privacy. “Security must be integrated from the ground up, beginning at the chip and silicon IP level to prevent hardware-based exploits.”
Advances in autonomous vehicles (AVs) and advanced driver-assistance systems are also driving the need for improvements, particularly in radar, LiDAR, and cameras for safer systems. Innovations in these technologies, powered by sensor fusion, are enabling vehicles to understand their environments in real time.
Contributing writer Stefano Lovati explores how perception and sensor fusion are driving evolution and innovations in the three main categories of automotive sensors: radar, LiDAR, and cameras. Lovati said that while every sensor type has its own limitations, sensor fusion “bridges this gap by intelligently combining data from sensors using advanced algorithms.”
Bitsensing tells us that 4D imaging radar is critical to AV commercialization and safe autonomous driving. The latest radar systems work at ranges of more than 200 meters, have low power consumption, and can easily be integrated into vehicle systems, with manufacturers already building systems designed specifically for the commercial AV market, said Jae-Eun Lee, CEO of bitsensing Inc.
However, Lee explained that many 4D radars are developed for ADAS rather than being built for full driverless functionality.
4D radar is important for the rapid commercialization of AV technology because it enables the rapid classification of different kinds of road users, but “to really drive the commercial AV market forward, it’s also vital that sensors are purposely designed for full autonomy, rather than being repurposed from devices for the consumer market,” he said.
Also reshaping automotive electronics are GaN and SiC power devices. These devices are being increasingly adopted into vehicles thanks to their faster switching and higher efficiency.
Lovati reports that GaN and SiC are no longer considered exotic semiconductors, and the automotive industry is leveraging their capabilities to switch faster, tolerate higher blocking voltages and temperatures, and dissipate less energy than conventional silicon.
He examines the current state and next steps for both SiC and GaN technologies across key automotive areas, including traction inverters, on-board chargers, DC/DC converters, and auxiliary power systems.
Don’t miss the connector and cable product roundup, looking at the latest rugged and flexible interconnects for high-reliability applications, including automotive, industrial, and military/aerospace. These connectors deliver miniaturization, reliable performance, and easier integration.
We also look at some of the latest innovations in automotive LEDs and LED drivers. Many of the latest LED developments focus on delivering smaller form factors for space-constrained and sleeker designs, improved thermal performance, and flexible color control. LED driver manufacturers also deliver simpler designs for easier integration and space savings, as well as advancements in areas such as packaging and heat dissipation.
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