• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

Core Series 3 scales AI to entry PCs, edge

Intel has introduced its Core Series 3 mobile processors targeting budget laptops and essential edge devices. Built on the same 18A process node as the Core Ultra Series 3 platform, they are described as the first “hybrid AI-ready” Core series processors, supporting AI workloads up to 40 TOPS at the platform level.

The processor lineup includes seven variants, one without an NPU. Compared with five-year-old PCs, Core Series 3 delivers up to 47% higher single-thread performance and 2.8× higher GPU-based AI performance, based on Intel’s internal benchmarks. Beyond laptops, it brings these gains to edge deployments such as robotics, smart buildings, POS terminals, and smart metering.

According to Intel, Core Series 3 is designed for all-day battery life, with up to 64% lower processor power consumption. The devices support high-speed connectivity, including up to two Thunderbolt 4 ports, Wi-Fi 7 (R2), and Bluetooth 6. They also support up to 48 GB of LPDDR5X memory at 7467 MT/s or up to 64 GB of DDR5 memory at 6400 MT/s.

Core Series 3-based consumer and commercial systems will be available from OEM partners starting April 2026, with edge systems following in Q2 2026. An in-depth overview of Core Series 3 is available here. 

Core Series 3 product page 

Intel

The post Core Series 3 scales AI to entry PCs, edge appeared first on EDN.

23 April 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-04-23 16:10:212026-04-23 16:10:21Core Series 3 scales AI to entry PCs, edge

Latest news

  • Analog uncertainty-aware design: How it replaces Monte Carlo with certifiable yield intelligence11 August 2026 - 16:31
  • Automotive low side output switch architecture suitable for 8 to 48 volt buses and beyond11 August 2026 - 13:26
  • Inference 2.0: How enterprise AI is reshaping AI system architectures11 August 2026 - 07:19
  • Dissecting third-party camera batteries, part 2: Swelling10 August 2026 - 14:00
  • Component and layout rules for USB-C, PD, and CMTI10 August 2026 - 07:53
  • Bear on a power pole7 August 2026 - 13:46
  • Why software-defined systems require a dynamic data layer7 August 2026 - 10:42
  • Paper-based passives show impact of re-thinking substrate6 August 2026 - 16:22
  • Drone bans harm customers and don’t actually close the door6 August 2026 - 13:20
  • BMICs enable scalable battery monitoring6 August 2026 - 04:16
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Link to: Signal generators enable Pulsar signal testing Link to: Signal generators enable Pulsar signal testing Signal generators enable Pulsar signal testing Link to: Anker brings on-device AI to earbuds Link to: Anker brings on-device AI to earbuds Anker brings on-device AI to earbuds
Scroll to top Scroll to top Scroll to top