• Become a member
  • Log In
The Institution of Electronics
  • Home
  • About us
    • Our Objectives
    • Our History
    • Governance of the Institution
  • The Electron Magazine
    • 2024
      • 2024 – Winter
      • 2024 – Spring
      • 2024 – Summer
      • 2024 – Autumn
    • 2025
      • 2025 – Winter
      • 2025 – Spring
      • 2025 – Summer
      • 2025 – Autumn
    • 2026
      • 2026 – Winter
  • Members
    • Membership Grades and Fees
    • Members’ Resources
      • The Electron Newsletter
      • The Archives
  • Education and Projects
    • National Electronics Competition
    • Student Members’ Projects
    • Arkwright Engineering Scholarships
  • News
  • Contact Us
  • Menu Menu
Uncategorised

SiC modules simplify high-voltage topologies

Two 3.3-kV SiC power modules from Wolfspeed target high-voltage energy infrastructure, including AI data centers, renewable energy systems, and grid equipment. The HAB900C33LM4 half-bridge baseplate module supports applications above 800 A, while the IBB020A33GM4 full-bridge baseplate-less module is rated for 100 A. Both modules accommodate 2-kV and higher DC-link architectures, allowing designers to reduce power stages and use simpler 2-level topologies.

Part of the LM platform, the HAB900C33LM4 half-bridge module is intended for converters used in solar, grid-scale energy storage, and wind-power systems. Wolfspeed states that it delivers up to 42% lower switching losses than comparable SiC products and more than 90% lower switching losses than IGBTs under the same test conditions. A member of the WolfPACK family, the IBB020A33GM4 baseplate-less device is designed for modular converter architectures, including solid-state transformers and series-stacked or parallel systems.

Both power modules use Gen 4 SiC technology and advanced packaging techniques, including sintered die attach, to enhance durability and power-cycling performance. Wolfspeed says the modules also maintain switching performance over temperature, helping reduce the size of magnetics and EMI filters while increasing system power density.

Samples of the HAB900C33LM4 and IBB020A33GM4 in industry-standard packages are available through Wolfspeed’s direct sales representatives.

Wolfspeed

The post SiC modules simplify high-voltage topologies appeared first on EDN.

27 May 2026
http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png 0 0 whdsolutions http://institutionofelectronics.ac.uk/wp-content/uploads/2022/12/IOE_LOGO.png whdsolutions2026-05-27 18:43:582026-05-27 18:43:58SiC modules simplify high-voltage topologies

Latest news

  • Record high wafer shipments. Can fabs keep pace?12 August 2026 - 07:51
  • Analog uncertainty-aware design: How it replaces Monte Carlo with certifiable yield intelligence11 August 2026 - 16:31
  • Automotive low side output switch architecture suitable for 8 to 48 volt buses and beyond11 August 2026 - 13:26
  • Inference 2.0: How enterprise AI is reshaping AI system architectures11 August 2026 - 07:19
  • Dissecting third-party camera batteries, part 2: Swelling10 August 2026 - 14:00
  • Component and layout rules for USB-C, PD, and CMTI10 August 2026 - 07:53
  • Bear on a power pole7 August 2026 - 13:46
  • Why software-defined systems require a dynamic data layer7 August 2026 - 10:42
  • Paper-based passives show impact of re-thinking substrate6 August 2026 - 16:22
  • Drone bans harm customers and don’t actually close the door6 August 2026 - 13:20
IOE LOGO 2

Become a member

click here

Become a member

click here

Become a subscriber

click here

Become a sponsor

click here

© Copyright - The Institution of Electronics | Website by WHD Solutions
  • Link to LinkedIn
  • Link to Facebook
  • Link to X
Link to: Entry-level MCUs ease system control Link to: Entry-level MCUs ease system control Entry-level MCUs ease system control Link to: AMD enables AI agents with Ryzen platforms Link to: AMD enables AI agents with Ryzen platforms AMD enables AI agents with Ryzen platforms
Scroll to top Scroll to top Scroll to top