Infineon prepares DTO247-packaged IGBTs
Infineon is developing TRENCHSTOP H7 IGBTs in a DTO247 package, which is twice the size of a standard TO247. A single high-current IGBT in a DTO247 can replace multiple lower-current TO247 IGBTs connected in parallel. Engineering samples of the 200-A and 350-A H7 IGBT variants are available now.
The DTO247 enables high power density and bridges the gap between TO247-based designs and module architectures. Additionally, its compatibility with both DTO247- and TO247-based architectures within the same system provides greater flexibility and customization. H7 IGBTs can be used in solar inverters, uninterruptible power supplies, and energy storage systems.
The DTO247-packaged portfolio will include 1200-V and 750-V H7 IGBTs with current ratings of 200 A, 250 A, 300 A, and 350 A. They feature 2-mm-wide leads for optimal conduction, a 7-mm pin-to-pin clearance, and a 10-mm creepage distance for enhanced safety and reliability. An integrated Kelvin emitter pin enables faster, more efficient switching.
Volume production of the TRENCHSTOP H7 IGBTs in DTO247 packages is scheduled for mid-2026. Datasheets were not available at the time of this announcement.
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