Page 21 - Spring 2024
P. 21
BREAKTHROUGH IN 2D
MATERIAL TECHNOLOGY
Researchers at the University of Manchester “ To overcome these limitations we devised
have achieved a breakthrough in 2D material a hybrid stamp, comprising a flexible silicon
science that is believed to have major nitride membrane for mechanical support and
implications for the future of electronics. an ultrathin metal layer as a sticky ‘glue’ for
picking up the 2D crystals. Using the metal layer
The technology involves the use of a fully we can carefully pick up a single 2D material
inorganic stamp in an ultra-high vacuum that has
and the sequentially ‘stamp’ its atomically flat
enabled the precise assembly of van der Waals lower surface onto additional crystals. The van
heterostructures with up to eight individual layers.
der Waals forces at this perfect interface cause
This has resulted in atomically clean interfaces adherence of these crystals, enabling us to
over large areas, significantly outperforming
construct flawless stacks of up to eight layers. “
existing methods bringing the commercialisation
of 2D material-based electronic devices closer to The team has since scaled up this ultraclean
reality. transfer process so as to be able to handle
larger, gas-phase-grown materials, achieving
The rigidity of the new stamp design dramatically millimetre-scale areas, a crucial capability for
reduced strain inhomogeneity in assembled
the scalability and potential application of such
stacks and a tenfold decrease in local observation materials in next-generation electronics.
was observed at ‘twisted’ interfaces relative to
current assemblies. The next stage is to evaluate the effectiveness of
the method for wafer-scale transfer of 2D films.
The new method provides a means of stacking
individual 2D materials in specific sequences, The University of Manchester has applied for
potentially creating designer crystals with a patent for this method and its associated
unique hybrid properties. Previous techniques for apparatus, and is looking for collaboration with
transferring these layers relied on organic polymer equipment manufacturers, semiconductor
membranes which tended to create surface foundries and electronic device manufacturers
contamination of the 2D materials. focusing on 2D materials.
Dr. Nick Clark is quoted as follows: Reference: West, P., Electronic Specifier, 1st. January
21
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