Page 4 - IOE_Winter 24
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ATTACK OF


          THE CLONES











          This informative presentation by Princeps’            4.  X-ray Fluorescence Spectrometry - non-
          Operations Director Ian Walker addressed one              destructive elemental analysis of the materials
          of the most challenging problems associated               of composition, plating thicknesses and similar
          with the modern electronics industry, namely the          attributes.
          issue of counterfeit components.
                                                                5.  Decapsulation - removal of packaging
          Many of these fakes are extremely difficult to detect,    material by mechanical, chemical and thermal
          in many cases actually passing quality control tests      means to expose the structure of the circuit for
          such as those specified in the aerospace standard         internal visual inspection.
          AS6081A, which has been in development for 11
                                                                Only through reference to Princeps’ extensive library
          years, yet has taken away mandatory testing that
                                                                of known-good devices was the team able to
          formed the bedrock of its predecessor AS6171.
                                                                positively identify parts that were actually clones
          Princeps is a specialist distributor of secure and    and made as such. These ‘good’ clones would
          traceable hard-to-source and obsolete electronic,     probably work for a while under certain conditions.
          electrical and electro-mechanical components
                                                                Princeps simplifies the sourcing of safe, traceable
          for high reliability applications and advanced
                                                                hard-to-find and obsolete components for
          industry sectors. Attendees were able to learn from
                                                                customers in high-reliability sectors and is a trusted
          a veteran industry expert about the specialist tools
                                                                single-source supplier for thousands of global
          and techniques that the company has acquired
                                                                manufacturers, taking responsibility for counterfeit
          in order to identify suspect components in the
                                                                mitigation, obsolescence management and
          electronics supply chain.
                                                                smoothing supply chain issues.
          Using the example of a real-world counterfeit
          part that the Princeps team intercepted, the
                                                                Extending Product Lifecycles for Military
          presentation focused on five specific techniques
                                                                and Aerospace Components.
          that formed the basis of its methodology:
                                                                From counterfeit components to obsolete
                                                                components, Rochester Electronics have focused
          1.   Stage 0 research - a review of all of the        on product replication solutions for obsolescence
             available documentation for the parts,             management in the military and aerospace sector,
             including a thorough trawl of all Product          where systems require longer development times
             Change Notifications issued by the                 and have longer production lifecycles than any
             manufacturer for the specific part as well as for   other industry.
             the entire range.
                                                                The pace of advancement in semiconductor
          2.  External Visual Inspection - including            technologies has accelerated the rate of
             deciphering what the various codes on the          component obsolescence and when faced with
             part mean and a thorough examination of its        critical part obsolescence manufacturers need to
             packaging.                                         find reliable replacements which not only address
                                                                single replacement events, but also cover the
          3.  Radiography - non-invasive x-ray inspection to
                                                                requirements for the full lifecycle of a program.
             detect internal physical defects or anomalies
             which would otherwise not be visible.              The unique qualities of many military and
                                                                aerospace designs add to the challenge of




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