Wireless MCU leverages 22-nm process technology

Renesas is sampling its first microcontroller built on a 22-nm process offering lower power consumption driven by reduced core voltages. The advanced process node uses a smaller die area for the same functionality, resulting in smaller chips with higher integration of peripherals and memory.

The first chip produced on the 22-nm process is an extension to the company’s RA family of 32-bit Arm Cortex-M microcontrollers. This wireless MCU delivers Bluetooth 5.3 Low Energy with the integration of a software-defined radio (SDR). What’s more, the device can be upgraded either with new application software or new Bluetooth capabilities to comply with the latest specification.

End product manufacturers can take advantage of the full feature set of previous Bluetooth LE specification releases. Whether designing devices for direction-finding applications using the Bluetooth 5.1 Angle of Arrival/Angle of Departure features or adding low-power stereo audio transmission to products by employing Bluetooth 5.2 isochronous channels, developers now only need one device to support all of these features.

Renesas is sampling the wireless MCU to select customers now, with full market launch expected in 4Q 2023. Customers who would like to sample the new device can contact their local Renesas sales office.

Renesas Electronics

Find more datasheets on products like this one at Datasheets.com, searchable by category, part #, description, manufacturer, and more.

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