PCIe 6.0 interposers work with EDSFF SSDs

PCIe 6.0 interposers from Teledyne LeCroy allow engineers to monitor devices conforming to the Enterprise and Data Center Standard Form Factor (EDSFF). Three types of interposers are available, each focusing on a specific EDSFF device, including E1.S, E1.L, and E3.x type solid-state drives.

Working with the company’s Summit PCIe protocol analyzers, the interposers support data rates of 2.5 GT/s, 5.0 GT/s, 8.0 GT/s, 16.0 GT/s, 32.0 GT/s, and 64.0 GT/s with up to x16 link widths. They provide a simple means to probe PCIe traffic between a host and PCIe add-in card.

In combination with the Summit family of PCI Express 5.0 protocol analyzers, the interposers now enable engineers to test product designs to 32 GT/s. Future Summit protocol analyzers, coming soon, will be able to use the PCIe 6.0 EDSFF interposer at full 64-GT/s speeds.

The PCIe 6.0 EDSFF interposers are available for immediate order. Any of the interposers can be upgraded to one of the other EDSFF models with the available adapter kits.

PCIe 6.0 interposer product page

Teledyne LeCroy

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