28-nm smart-card chip secures payment processing

Built on the mature 28-nm process node, Infineon’s SLC26P security controller targets high-volume payment applications using smart cards. By enabling the 28-nm node for security ICs, Infineon not only offers long-term, dependable sourcing, but also empowers higher performance and more energy efficient products for the payment industry.

Working with foundry partner TSMC, Infineon believes the SLC26P is the first security controller for payment processing based on 28-nm technology. The device leverages the ARMv8-M microcontroller architecture, which is optimized for deeply embedded systems and low-latency processing.

EMVCo certification of the SLC26P security controller is expected before the end of 2022. Infineon plans to ramp-up production of the device in the first half of 2023, enabling EMV payment card issuance with the new technology beginning in Q2 2023. Samples based on the SLC26P are available upon request. A datasheet was not available at the time of this announcement.

Infineon Technologies

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